Semiconductor simulation with COMSOL Multiphysics

Semiconductor devices combine tiny geometries, several materials and strongly coupled physics. A resonator’s frequency depends on temperature and process variation. A bond wire fails after thousands of thermal cycles. Physixfactor uses COMSOL Multiphysics to make these effects visible before they show up in production. The projects below show how we approach MEMS devices, chip packaging and thermal behaviour.

 

Dogbone MEMS

Semiconductor simulation projects.

MEMS Resonator

Frequency stability, anchor losses and capacitive non-linearity of a silicon resonator.

Wire Bonding

Thermal stress, intermetallic growth and pad damage in gold and copper bonding

Thermal stress in Silicon wafer

Thermal behaviour of IC structures

Heat distribution in a chip with many components and an embedded MEMS