Wear Reduction of Wire Dies
It is important to use the data of your materials used for the wire-drawing-dies. When you use mono or polycrystalline diamond (PCD) dies it generates drawing force and the temperatures which are lower. The temperature in the die is influenced by the drawing angle and the lubricant. Also of importantcy is the casing material which which should be strong enough to prevent breaking of the die. All this is covered in the analyses of Physixfactor.
Wire Die Simulation
To reduce wear in the wire die, one should realise that many parameters in the die will have an effect on this. The drawing angle, the composition of the casing material (alloy), hardness of the casing around the die material. The ability to absorp the heat so that the temperatures do not have to much influence on the wear process. Based on many years of experience Physixfactor is able to advice you on the appropriate choice of alloys in order to increase the lifetime of your wire dies. Thermal management of wire dies is a very important topic and Physixfactor is able to advice on this. Especially the design and size of the core (Diamond-like) material, the sintering processes and strength and thermal stress in the wire dies all contribute to the performance and quality of the dies strongly.